Versum Materials, Inc. (NYSE: VSM), a leading global materials supplier to the semiconductor industry, announced today that it has agreed to acquire Dynaloy, LLC from Eastman Chemical Company (NYSE: EMN) for approximately $13 million. Dynaloy is a leading supplier of formulated cleaning solutions for the semiconductor and specialty manufacturing industries.
Kim Pollard, technology manager for Dynaloy, LLC, a subsidiary of Eastman Chemical Company, will give a presentation on the importance of effective inspection of the side walls to ensure they’re clean March 15th at noon* during the International Microelectronics Assembly and Packaging Society (iMAPS) conference near Phoenix, Arizona.
INDIANAPOLIS, Ind., September 29, 2015—With the introduction of the new plasma dicing process to singulate chips, Dynaloy offers a compatible cleaning solution. In addition to removal of PER for TSV formation, Dynaloy has developed a cleaning solution for removal of polymers and fluorinated residue after the new plasma dicing process.
INDIANAPOLIS, Ind., November 19, 2014—In response to evolving industry trends and customer preferences for products with better environmental, health, and safety (EHS) profiles, Dynaloy™ LLC is launching three new formulated products that offer exceptional performance without the use of certain chemicals, while continuing to offer its line of traditional cleaners.
INDIANAPOLIS, Ind., April 16, 2014 – Scientists from Dynaloy, LLC and EV Group will explain a new, one-step cleaning process for removing negative dry film and negative spin-on film photoresist on April 24, 2014 at the SEMATECH Surface Preparation and Cleaning Conference in Austin, Texas. Authors from Dynaloy include Technology Manager Kim Pollard, Chemist Travis Acra, and Chemical Engineer Richard Peters.
INDIANAPOLIS, Ind., March 27, 2014- Finding the right product to remove challenging materials just got easier thanks to the launch of the redesigned website for Dynaloy™, Dynaloy.com. Dynaloy LLC develops, manufactures and markets world class advanced cleaning solutions for semiconductor and specialty applications.
3DInCities.com - March 20, 2014 - At IMAPS DPC 2014, which took place March 11-13, 2014, in Fountain Hills, AZ, there were several presentations focused on new developments in cleans for TSVs and Cu bumps for 2.5D and 3D IC processes. Cleans has become increasingly important as bump pitches are reduced and TSVs have higher aspect ratios. It’s not just about being clean enough, but also about surface preparation for the next process step.
INDIANAPOLIS, Ind., February 24, 2014 - A team of researchers from Dynaloy and Solid State Equipment Corporation have developed a robust, cleaning solution and process for the removal of post etch residue from through-silicon vias (TSVs). Kim Pollard, Technology Manager at Dynaloy, will discuss this new cleaning process and chemistry at the Device Packaging Conference for the International Microelectronics Assembly and Packaging Society (iMAPS) on March 12th in Scottsdale, Arizona.
3DInCites.com - August 12, 2013 - Françoise von Trapp, featured blogger for 3D InCites, shares her thoughts on a recent visit to Dynaloy. Examining surface preparation, process complexities and safety, von Trapp outlines the foundations of Dynaloy’s approach to clean.
ST. FLORIAN, Austria and INDIANAPOLIS, Ind., June 17, 2013 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly owned subsidiary of Eastman Chemical Company, today introduced CoatsClean™—an innovative single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, microelectromechanical systems (MEMS) and compound semiconductor markets.
3DInCites.com - June 6, 2013 - Françoise von Trapp, featured blogger for 3D InCites says "while interviewing SSEC on its TSV clean and TSV reveal processes, and Dow Corning on its temporary bond/debond process, the name “Dynaloy” kept popping up in reference to chemistries used for cleaning residues in all these process steps."
KINGSPORT, Tenn., Aug. 3, 2011 – Eastman Chemical Company (NYSE:EMN) announced that one of its wholly owned subsidiaries has acquired from E&A Industries, Inc., the assets of Dynaloy, LLC, a specialty chemical business based in Indianapolis, Indiana. This acquisition, which includes Dynaloy’s inventory, equipment, intellectual property, and customer contracts, supports Eastman’s growth efforts for the electronic materials product line of its Coatings, Adhesives, Specialty Polymers and Inks (CASPI) segment.
In keeping with Dynaloy’s commitment to be a responsible steward of the environment, we have taken a proactive approach to providing better material choices for effective products and supporting our customers’ stewardship programs.
Indianapolis, IN, May 12, 2009 - Dynaloy™, LLC is enjoying success and investing for the future. Dynaloy's Development and Applications lab moves forward with the addition of the Helios NanoLab from FEI. High resolution SEM images and cross-sectioning ability are critical for providing semiconductor customers visual data to validate the effectiveness of Dynaloy's removers and cleaning solutions.