Photoresist and Residue Removers

Photoresist and Residue RemoversDynaloy is the pre-eminent supplier of photoresist and residue removers designed for advanced packaging applications including solder bumping, Cu pillar, μ-bumping, 3DIC and TSVs. Our products are specifically designed to meet the stringent requirements of the most demanding applications.

Dynaloy provides highly effective photoresist and residue removers and aligns with the industry’s roadmap to achieve cleaning and surface preparation requirements. Our commitment extends to identify and implement safer processing materials for the industry.

For more information view our brochure F-370B Photoresist and Residue Removers.

CoatsClean

CoatsClean™ ER105
A new technology for post silicon etch residue removal, CoatsClean™ ER105 requires low solution volumes for cleaning. CoatsClean™ ER105 delivers fast cleaning activation for high single wafer throughput.
CoatsClean™ PR100
A new technology for difficult photoresist removal, CoatsClean™ PR100 requires low solution volume for cleaning. CoatsClean™ PR100 delivers fast cleaning activation for high single wafer throughput.
CoatsClean™ PR520
A non-TMAH stripping technology for difficult photoresist removal, CoatsClean™ PR520 requires low solution volumes for cleaning. CoatsClean™ PR520 delivers fast cleaning activation for high single wafer throughput.

FlipStrip

FlipStrip
FlipStrip is used for the removal of negative dry-film photoresists that are difficult to remove due to high temperature reflow process. It is compatible with Cu, Al, and most polyimide (PI), very high loading capacity of photoresist and has a greater than a 72-hour bath life.

Dynastrip

Dynastrip™ 7000
Dynastrip™ 7000 is used for the removal of negative dry-film photoresists. Benefits include cost effective removal with high loading capacity and good heated solution lifetime stability.
Dynastrip™ 7000T
Dynastrip™ 7000T provides cost-effective for removal of both negative dry-film photoresists and positive resists. It also has excellent compatibility with most PI layers.
Dynastrip™ 7700
Dynastrip™ 7700 is successful for dissolving hard to remove thick-negative photoresist in solder bumping processes including leadfree processes. Dynastrip™ 7700 is compatible with Cu, Ni, and Sn.
Dynastrip™ 7700S
Dynastrip™ 7700S is successful for dissolving hard to remove thick-negative photoresist in solder bumping processes including leadfree processes. Dynastrip™ 7700S is compatible with Cu, Ni, and Sn.
Dynastrip™ AP7630
Dynastrip™ AP7630 is uniquely formulated for removal of difficult photoresist and tough post etch residues created by O2 plasma ashing after dry etch on vias and metals.
Dynastrip™ AP7880-C
Dynastrip™ AP7880-C is proven and patented technology for dissolving hardest to remove thick-negative dry film photoresist in leadfree solder bumping and Cu pillar processes.
Dynastrip™ AP7880-NA
Dynastrip™ AP7880-NA is proven and patented removal technology, formulated for removal of thick photoresist used in advanced packaging and Cu pillar processes.
Dynastrip™ AP7880-NT
Available in Asia Pacific market, Dynastrip™ AP7880-NT is a proven and patented removal technology, formulated for removal of thick photoresist used in advanced packaging and Cu pillar processes. Dynastrip™ AP7880-NT also removes thick negative dry film or thick positive or negative spin on photoresist.
Dynastrip™ AP7880-T
Dynastrip™ AP7880-T is effective for dissolving hard to remove thick-negative photoresist in solder bumping processes including Cu pillar and lead-free processes. It has high loading capacity results in low process CoO. Available only in Asia Pacific market.
Dynastrip™ AP7900
Formulated to strip thick positive photoresist in Cu pillar processes with with loading capacity and long heated bath lifetime.
Dynastrip™ DL3000
Dynastrip™ DL3000 is noncorrosive to most metals and strips cyclized negative photoresist that has been exposed and processed. Dynastrip™ DL3000 contains no phenols or chlorinated hydrocarbons.
Dynastrip™ DL7630
For use in single-wafer clean processes, Dynastrip™ DL7630 removes photoresist and post etch residue from dry metal etch processes. Dynastrip™ DL7630 also dissolves negative photoresist in solder bumping processes.
Dynastrip™ DL88
Formulated to strip positive photoresist from metals that are sensitive to corrosion, Dynastrip™ DL88 is completely water rinsable. It is effective for flux residue removal and batch spray processing.
Dynastrip™ DL8800
Designed to strip positive photoresist, Dynastrip™ DL8800 has exceptionally low metal etch rates, and contains no NMP, DMSO, TMAH or Hydroxyl Amine.
Dynastrip™ DL9150
With cutting edge technology for thick dry film or liquid photoresist and post etch residue removal, Dynastrip™ DL9150 provides outstanding cleaning and metal compatibility while raising the bar for environmental, health, and safety (EH&S) compliance. The improved EH&S footprint formulation contains no Hydroxyl Amine or Tetramethyl ammonium hydroxide (TMAH).
Dynastrip™ DL9240
A green technology option for photoresist removal, Dynastrip™ DL9240 has an improved EH&S footprint formulation that contains no DMSO and no Hydroxyl Amine or Tetramethyl ammonium hydroxide (TMAH). Dynastrip DL9240 also removes negative dry film resist.

Dynasolve

Dynasolve 219
Dynasolve 219 removes temporary adhesive materials in applications where a better penetrating solvent is required due to a smaller exposed surface areas. It quickly disolves silicone based adhesives.
Dynasolve FS8320
Dynasolve FS8320 is a semi-aqueous defluxer designed to be effective at the removal of baked-on solvent-based flux residues. It is an excellent choice for removal of flux residues from wafers after the bumping process. Dynasolve FS8320 is exceptionally safe on all solder types including lead-free, high-lead, and eutectic.
Dynasolve PI4310
A proven solution for removal or rework of PI dielectric layers, Dynasolve PI4310 removes PI through various process stages from coat through post develop bake process.