CoatsClean™

CoatsClean™ is an innovative process and material technology that enables removal of difficult resist and residue through its unique front-side coating technology. CoatsClean applies the right chemistry in the right process conditions to provide optimal cleaning results, enabling engineers to solve wafer cleaning challenges. CoatsClean technology process applies cleaning chemistry precisely when and where it’s needed.

CoatsClean™ formulations are created to work specifically with the EVG320RS platform from EV Group. These formulas are purposely designed to perform with the CoatsClean™ patented process of Coat, Heat and Rinse.

 
As a result of this efficiency, device manufacturers can take advantage of:
  • Significant reduction in chemical use
  • Lower wafer-defect rates
  • Faster process times





Users will realize significant reductions in total cost of ownership and consistent cleaning. This has been achieved by the industry-leading collaboration between two pioneering semiconductor companies, Dynaloy and EV Group. This collaboration has created a material, process and equipment interaction that provides the right material in the right process on the right tool set.

CoatsClean™ technology enables:CoatsClean Technology
  • Performance
  • Flexibility
  • Results not currently available with today’s photoresist and residue removal technologies
As a leader in specialized materials for photoresist and residue removal, Dynaloy is making wafer cleaning more precise, more efficient and faster than ever.

As a leader in innovative semiconductor equipment, EV Group is enabling the interaction of material and process in a new way.

CoatsClean™ technology represents the future of wafer cleaning.

For more information view our brochure F-370B Photoresist and Residue Removers

CoatsClean

CoatsClean™ ER105
A new technology for post silicon etch residue removal, CoatsClean™ ER105 requires low solution volumes for cleaning. CoatsClean™ ER105 delivers fast cleaning activation for high single wafer throughput.
CoatsClean™ PR100
A new technology for difficult photoresist removal, CoatsClean™ PR100 requires low solution volume for cleaning. CoatsClean™ PR100 delivers fast cleaning activation for high single wafer throughput.
CoatsClean™ PR520
A non-TMAH stripping technology for difficult photoresist removal, CoatsClean™ PR520 requires low solution volumes for cleaning. CoatsClean™ PR520 delivers fast cleaning activation for high single wafer throughput.