• Dynaloy Scientists to Highlight Time- and Money-Saving Benefits of New Single Wafer Cleaning Technology for Advanced Packaging Applications

    INDIANAPOLIS, Ind., April 16, 2014 – Scientists from Dynaloy, LLC and EV Group will explain a new, one-step cleaning process for removing negative dry film and negative spin-on film photoresist on April 24, 2014 at the SEMATECH Surface Preparation and Cleaning Conference in Austin, Texas. Authors from Dynaloy include Technology Manager Kim Pollard, Chemist Travis Acra, and Chemical Engineer Richard Peters.
  • Solve Your Cleaning Problems: Dynaloy™ Opens New Online Gateway to High Quality Off-The-Shelf Products and Customized Cleaning Technologies

    INDIANAPOLIS, Ind., March 27, 2014- Finding the right product to remove challenging materials just got easier thanks to the launch of the redesigned website for Dynaloy™, Dynaloy LLC develops, manufactures and markets world class advanced cleaning solutions for semiconductor and specialty applications.
  • Latest Developments in Cleans for TSVs and Cu Bumps - March 20, 2014 - At IMAPS DPC 2014, which took place March 11-13, 2014, in Fountain Hills, AZ, there were several presentations focused on new developments in cleans for TSVs and Cu bumps for 2.5D and 3D IC processes. Cleans has become increasingly important as bump pitches are reduced and TSVs have higher aspect ratios. It’s not just about being clean enough, but also about surface preparation for the next process step.
  • Removing Photoresist and Polymer Residue: Dynaloy™ Researchers to Detail One-Step Cleaning Process for TSVs

    INDIANAPOLIS, Ind., February 24, 2014 - A team of researchers from Dynaloy and Solid State Equipment Corporation have developed a robust, cleaning solution and process for the removal of post etch residue from through-silicon vias (TSVs). Kim Pollard, Technology Manager at Dynaloy, will discuss this new cleaning process and chemistry at the Device Packaging Conference for the International Microelectronics Assembly and Packaging Society (iMAPS) on March 12th in Scottsdale, Arizona.
  • Dynaloy: A Formula for Cleans - Article - August 21, 2013 - A second installment from Françoise von Trapp, featured blogger for 3D InCites. von Trapp examines what differentiates Dynaloy from other chemical cleans companies.
  • Understanding the Complexity of Cleans - Article - August 12, 2013 - Françoise von Trapp, featured blogger for 3D InCites, shares her thoughts on a recent visit to Dynaloy. Examining surface preparation, process complexities and safety, von Trapp outlines the foundations of Dynaloy’s approach to clean.
  • EV Group And Dynaloy Jointly Develop Complete Single-Wafer Cleaning Solution For 3D-IC/TSV, Advanced Packaging, MEMS And Compound Semiconductor Applications

    ST. FLORIAN, Austria and INDIANAPOLIS, Ind., June 17, 2013 - EV Group (EVG), a leading supplier of wafer bonding and lithography equipment, and Dynaloy, LLC, an international manufacturer of chemicals for the electronics industry and wholly owned subsidiary of Eastman Chemical Company, today introduced CoatsClean™—an innovative single-wafer photoresist and residue removal technology designed to address thick films and difficult-to-remove material layers for the 3D-ICs/through-silicon vias (TSVs), advanced packaging, microelectromechanical systems (MEMS) and compound semiconductor markets.
  • A Word about Cleans for 3D ICs - Article - June 6, 2013 - Françoise von Trapp, featured blogger for 3D InCites says "while interviewing SSEC on its TSV clean and TSV reveal processes, and Dow Corning on its temporary bond/debond process, the name “Dynaloy” kept popping up in reference to chemistries used for cleaning residues in all these process steps."
  • Removing Barriers to All-Wet Single-Wafer Cleans - Article

    September - October 2012 - Chip Scale Review - Volume 16, Number 5
  • Eastman Acquires Dynaloy, LLC

    KINGSPORT, Tenn., Aug. 3, 2011 – Eastman Chemical Company (NYSE:EMN) announced that one of its wholly owned subsidiaries has acquired from E&A Industries, Inc., the assets of Dynaloy, LLC, a specialty chemical business based in Indianapolis, Indiana. This acquisition, which includes Dynaloy’s inventory, equipment, intellectual property, and customer contracts, supports Eastman’s growth efforts for the electronic materials product line of its Coatings, Adhesives, Specialty Polymers and Inks (CASPI) segment.
  • Cleaning: The Forgotten Challenge - Article

    January/February 2011 - Chip Scale Review
  • Environmental Stewardship Program

    In keeping with Dynaloy’s commitment to be a responsible steward of the environment, we have taken a proactive approach to providing better material choices for effective products and supporting our customers’ stewardship programs.
  • Dynaloy LLC appoints Diane Scheele Technical Sales and Marketing Director

    Indianapolis, IN, November 19, 2009 - Dynaloy would like to announce that Diane Scheele has been appointed Technical Sales and Marketing Director for its Semiconductor division.
  • Dynaloy, LLC announces the installation of the Helios NanoLab SEM/FIB

    Indianapolis, IN, May 12, 2009 - Dynaloy™, LLC is enjoying success and investing for the future. Dynaloy's Development and Applications lab moves forward with the addition of the Helios NanoLab from FEI. High resolution SEM images and cross-sectioning ability are critical for providing semiconductor customers visual data to validate the effectiveness of Dynaloy's removers and cleaning solutions.


IWLPC - International Wafer-Level Packaging Conference
November 11, 2014 - November 13, 2014
San Jose, CA
International Wafer-Level Packaging Conference