Dynastrip AP7880-C
Very effective for dissolving hard to remove thick negative photoresist in solder bumping processes including lead free processes. Effective for removal of post etch residues created by O2 plasma ashing after dry etch on vias and metals. DynastripAP7880-C is compatible with Al, Cu, Ni, Sn

Dynastrip AP7880-T
Effective for dissolving hard to remove thick negative photoresist in solder bumping processes including lead free processes. DynastripAP7880-T is compatible with Al, Cu, Ni, Sn

Dynastrip DL6000
Effective for dissolving negative photoresist in solder bumping processes. Effective removal of post etch residue from dry metal etch processes.

Dynastrip 7700
Effective for dissolving hard to remove thick negative photoresist in solder bumping processes including lead free processes. Dynastrip7700 is compatible with Cu, Ni, Sn

Dynastrip 7700S
Effective for dissolving hard to remove thick negative photoresist in solder bumping processes including lead free processes, Cu pillar and Cu pillars with Pb-free cap. Dynastrip7700 is compatible with Cu, Ni, Sn

FlipStrip
For removal of negative dry film photoresists that are difficult to remove due to high temperature reflow process. Flipstrip is compatible with Copper, Aluminum, and most PI. Flipstrip can handle a very high loading of photoresist and has up to a 72 hour bath life

Dynastrip 7000
For removal of negative dry film photoresists can handle a very high loading of photoresist and has >48 hour bath life.

Dynastrip 7000T
For removal of negative dry film photoresists and positive resists. Excellent compatibility with most polyimide layers.

Dynastrip DL88
Formulated to strip positive photoresist from metals that are sensitive to corrosion. Dynastriptm 88 is completely water rinseable. It also is effective for flux residue removal.

Dynastrip AP8800PR
Very effective for positive photoresist removal from Cu processes. Non-NMP formulation can be used in spray or immersion processes.

Dynastrip DL3000
Designed to strip cyclized negative photoresist that have been exposed and processed. The Dynastrip3000 is non-corrosive to most metals and, contains no phenols or chlorinated hydrocarbons.

Dynasolve PI4310
For removal or rework of polyimide (PI) dielectric layers. Removes PI through various process stages, from coat through cure.

Dynasolve FS8320
Designed specifically for wafer level packaging applications including flip chip bumping where rosin, no-clean and watersoluble flux are used.

Dynasolve 219
For removal of temporary adhesive materials in applications where a better penetrating solvent is required due to a smaller exposed surface area.