MIME-Version: 1.0 Content-Type: multipart/related; boundary="----=_NextPart_01C3D633.0F5AA220" This document is a Web archive file. If you are seeing this message, this means your browser or editor doesn't support Web archive files. For more information on the Web archive format, go to http://officeupdate.microsoft.com/office/webarchive.htm ------=_NextPart_01C3D633.0F5AA220 Content-Location: file:///C:/E363E902/DynasolveSP9205Web.htm Content-Transfer-Encoding: quoted-printable Content-Type: text/html; charset="us-ascii"

DYNASOLV=
E SP9205
Aqueous
Stencil/Misprint Cleaner
Dynasolve SP9205 is an aqueous-based blend of surface-active materials that are formulated to prov= ide excellent cleaning without the use of solvents or alkalinity sources. This product is designed for screen printing applications for the removal of uncured solder pastes and surface mount adhesives from stencils and misprinted circuit board assemblies. It is a non-flammable product that contains no VOC’s and is pH neutral. Dynasolve SP9205 is a low-foam ver= sion of Dynasolve SP9200 and can be = used in high-pressure spray applications.
BENEFITS: =
&nb=
sp; =
&nb=
sp; =
· = good performance
· = water dilutable<= /p>
· = economical; long bath life
· = no flash point
· = improved rinsing speed compared to semi-aque= ous products
OPERATING RECOMMENDATIONS:
|
Wash bath make-up |
10-25% with DI wate=
r |
|
Wash parameters |
temperature of
110-140°F/ 43°C-60°C;
dwell time of 1-3 minutes (spray); product will foam if used below
110°F |
|
Rinse parameters |
DI water; temperatu=
re of
ambient to 120°F/ 50°C; spray application is preferred |
|
Dry |
forced air, oven, o=
r other
appropriate method to remove all DI water |
TYPICAL
SPECIFICATIONS:
|
Appearance |
clear to light ambe=
r liquid |
|
Flash point |
none |
|
pH, 1% in DI water<= o:p> |
7-8 |
|
Specific gravity |
1.034 |
|
Foam |
low foam |
|
Viscosity |
80 cp (concentrate)=
|
APPLICATIONS:=
|
Application |
Contaminants
removed |
|
stencils, fingers,
misprints, screen printer, assemblies, through-hole & surface mount
electronics |
uncured SMD adhesiv=
es, raw
solder pastes of all types |
HEALTH & =
SAFETY:
Safety goggles and impervious gloves should be w=
orn
when handling any industrial chemical, including Dynasolve SP9205. Please consult the MSDS before use=
or
disposal.
ENVIRONMENTAL=
&
REGULATORY INFORMATION:
<=
span
style=3D'font-size:14.0pt;mso-bidi-font-size:10.0pt;font-family:Symbol;
mso-fareast-font-family:Symbol;mso-bidi-font-family:Symbol'>·
HAP &=
nbsp; &nbs=
p; &=
nbsp; &nbs=
p; no &=
nbsp;
<=
span
style=3D'font-size:14.0pt;mso-bidi-font-size:10.0pt;font-family:Symbol;
mso-fareast-font-family:Symbol;mso-bidi-font-family:Symbol'>·
Ozone Deple=
tion &=
nbsp; &nbs=
p; none
<=
span
style=3D'font-size:14.0pt;mso-bidi-font-size:10.0pt;font-family:Symbol;
mso-fareast-font-family:Symbol;mso-bidi-font-family:Symbol'>·
VOC - % by =
weight &=
nbsp; &nbs=
p; zero
<=
span
style=3D'font-size:14.0pt;mso-bidi-font-size:10.0pt;font-family:Symbol;
mso-fareast-font-family:Symbol;mso-bidi-font-family:Symbol'>·
SARA 313 &a=
mp;
RCRA &nb=
sp; =
not
regulated
<= span style=3D'font-size:14.0pt;mso-bidi-font-size:10.0pt;font-family:Symbol; mso-fareast-font-family:Symbol;mso-bidi-font-family:Symbol'>· DOT Regulat= ion &= nbsp; &nbs= p; not regulated
|
The information in this
sheet is based upon our own research and is considered accurate. However, we make no warranty eit=
her expressed
or implied regarding accuracy and results to be obtained, because operati=
ng
conditions of users are beyond our control. |
Last
Revised By: Lauri Kirby Last
Revision Date: |