Indianapolis, IN, October 24, 2006 - Dynaloy the leading
supplier of removers for wafer bumping has announced the
commercial availability of DynastripTM7700 Series remover for
thick resists. This product is aligned with the ITRS roadmap
for meeting the requirement of reliably producing fine pitch
bumps on top of < 90 nm copper low-k structures. The product
operates in full harmony with a variety of dielectric
materials and metals as well as various solder plating
solutions.
Donn Detzler, President of Dynaloy recently commented that
the company developed this product as a result of two
specific customer and resist supplier requests for a fast
acting, low temperature material needed remove thick resist
from high value wafers containing the latest multi-cell
processors being used in advance games, PCs and
supercomputers.
Previously, resists used in advanced bumping applications
have lifted off and partially dissolved the adhesion layer,
forming particles. Often these particles and residue
required additional wet or plasma processing to remove.
DynastripTM7700 Series products completely dissolve the
resists and the adhesion layer while assuring great
compatibility with the bump metallurgy and passivation
materials. This makes finer pitch bumps and high reliability
processing a reality. The products enable plating with
eutectic, high-lead and lead-free solutions, making the
transition to total lead-free processing trouble free.
The product series is patent pending in the US and foreign
countries.
Dynaloy was founded in 1964 as a supplier of specialty of
cleaners and removers for use in advanced avionics,
semiconductors and electronic packaging. Today Dynaloy is a
subsidiary of E&A Industries and operates independently from
a 43,000 square foot manufacturing and technical facility in
Indianapolis, Indiana. Dynaloy sells and distributes its
products directly or through a worldwide network of
distributors. As the leading supplier of removers for thick
resists used in wafer bumping and wafer level packaging,
Dynaloy has established itself as the POR supplier of
removers for all licensees of FlipChip International’s
printed bump process. E & A Industries is a privately held
corporation that has been successfully acquiring and growing
companies throughout North America and Europe since 1977.
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